- Previous Article
- Next Article
- Table of Contents
Journal of the Electrochemical Society, Vol.153, No.7, C472-C482, 2006
Growth of metal around particles during electrodeposition
The deposition profile of metal around particles during electrodeposition was studied by atomic force microscopy measurements. In addition to these measurements, the local metal deposition rate around particles was determined from electrodeposited nickel iron multilayers using "process archeology." A strong correlation was found between the metal deposition profile and the surface properties of the particles. Hydrophilic particles are pushed ahead by metal that deposits underneath the particles before they become incorporated. Metal deposition does not take place underneath hydrophobic particles, hence incorporating from the start of the metal deposition. For electrically conductive particles, metal deposits on the particles which causes such particles to incorporate almost immediately. (c) 2006 The Electrochemical Society.