We developed a conductive epoxy/amine system containing polyaniline doped with dodecylbenzenesulfonic acid (PAni.DBSA). The curing behaviors of diglycidyl ether of bisphenol A with triethylenetetramine (TETA), PAni.DBSA, and both amine compounds at different concentrations were investigated by differential scanning calorimetry (DSC). Epoxy/TETA systems containing PAni.DBSA presented two distinct exothermic peaks at 90 degrees C due to the cure by TETA as a hardener and at 236 degrees C related to PAni.DBSA as the Curing agent. The presence of PAiii.DBSA in the systems constituted by epoxy/hardener in stoichiometric proportions resulted in a decrease in the glass-transition temperature of the epoxy matrix, as indicated by DSC and dielectric analyses. Electrical conductivity was determined in the epoxy/amine networks, with the TETA concentration kept constant and also in stoichiometric proportions of mixed hardener (TETA + PAni.DBSA) to epoxy resin. The last condition resulted in a higher electrical conductivity. (c) 2006 Wiley Periodicals, Inc.