화학공학소재연구정보센터
Journal of the Korean Industrial and Engineering Chemistry, Vol.17, No.4, 357-360, August, 2006
단열재용 페놀폼의 물성과 열적특성
Properties and Thermal Characteristics of Phenol Foam for Heat Insulating Materials
E-mail:
초록
본 연구에서는 단열재로서의 페놀수지(PF) 발포폼의 물성과 응용가능성을 검토하였다. 실험결과 페놀수지 발포폼의 밀도는 0.030 g/cm3를 나타내었고, 열전도율은 0.026 kcal/m.h.℃를 나타내었다. 또한 페놀수지 발포폼은 500 ℃로 1 h 동안 열을 가했을 경우 약 71.7 wt%가 휘발되었다. 그리고 페놀수지 발포폼의 화학구조는 단열재로서의 중요 물성인 closed cell 구조형태를 갖는 것으로 분석되었다. 따라서 제조된 페놀수지 발포폼은 단열소재로서의 우수한 물성을 갖는 것으로 확인되었다.
In this study, we studied the physical properties and application of PF foam as heat insulating materials. In the experimental results, the density of PF foam showed 0.030 g/cm3 and the thermal conductivity showed 0.026 kcal/m.h.℃. Also, thermal resistance of the prepared PF foam was volatilized about 71.7 wt% when the temperature was 500 ℃ (1 h). And the chemical structure of PF foam have a closed cell type in the important properties as heat insulating materials. Therefore, it was confirmed that the prepared PF foam had excellent performance as heat insulating materials.
  1. Hongbin S, Andre JL, Steven RN, Compos. Pt. A-Appl. Sci. Manuf., 34, 941 (2003) 
  2. Jurgen Troitzsch, Plastics Flammability, p133-170, Hanser Publishers, Munich (2004)
  3. Mao J, Chang J, Chen Y, Fang D, Chem. Ind. Engine., 15, 38 (1998)
  4. Knop A, Scheip W, Chemistry and application of phenolic resins, p195-230, Springer, New York (1979)
  5. Landrock AH, Handbook of plastic foams, p301-305, Noyes Publications, New Jersey (1995)
  6. Horrocks AR, Price D, Fire Retardant Materials, p220-249, UK, The UK Fire Chemistry Group of the Society of Chemical Iudustry (2000)
  7. Nishizawa H, Practical Application and Technology of Flame retardant Materials, p121-135, CMC (2004)
  8. NIIR BOARD, Modern Polymer Technology and Applications, p314-322, Asia Pracific Business Press Inc. (2004)
  9. Goldschmidt A, Streitberger HJ, BASF Handbook on coating Technology, p337-349, Primedia, Hannover, Germany (2003)
  10. Ohkatsu Y, Research and Development of Polymer Additives, p122-141, CMC (2000)
  11. Castleman AW, Berry RS, Haberland H, Kondow T, Clusters and Nanomaterials, p28-68, Saladruck Berlin (2001)
  12. PKT Oldring and N Tuck, Resin for Surface coating Volume Ⅲ, Polyurethanes, Polyamides, Phenolplasts, Aminolplastics and Maleic Resins, p208-216, John Wiley & Sons Ltd. (2001)