단분산 가교고분자 미립자 및 그의 무전해 니켈도금체의 기계적 물성 연구

김동옥; 진정희; 손원일; 오석헌; Dong Ok Kim; Jeong Hee Jin; Won IL Shon; Seok Heon Oh

Polymer(Korea), Vol.30, No.4, 332-337, July, 2006

Export Citation

단분산 가교고분자 미립자 및 그의 무전해 니켈도금체의 기계적 물성 연구

Mechanical Properties of Monodisperse Polymer Particles and Electroless Ni Plated Monodisperse Polymer Particles

김동옥^†, 진정희, 손원일, 오석헌

한화석유화학 중앙연구소

Dong Ok Kim^†, Jeong Hee Jin, Won IL Shon, and Seok Heon Oh

Hanwha Chemical Research & Development Center, 6 Shinsung-Dong, Yusung-gu, Daejeon 305-804, Korea

E-mail:

초록

무유화제중합으로 제조된 폴리(메틸 메타크릴레이트)(PMMA) 시드 고분자 미립자에 가교단량체인 ethylene glycol dimethacrylate(EGDMA), 1,6-hexanedioldiacrylate(HDDA) 또는 그 혼합액을 흡수시키고, 이를 중합하여 단분산 가교고분자 미립자를 제조할 시 1)흡수된 가교단량체와 시드 고분자 미립자의 중량비(흡수율) 변화, 2)가교단량체 혼합액에서의 EGDMA의 함량비 변화 및 3)중합개시제의 사용량 변화 등에 따라 제조된 단분산 가교고분자 미립자 및 그의 무전해 니켈도금체의 기계적 물성인 탄성복원율, 압축탄성률, 파괴강도 및 파괴변형률의 변화를 micro compression test(MCT)를 사용하여 측정하였다. 이번 연구를 통해 흡수율의 증가는 파괴강도에만 큰 영향을 미쳤으나, EGDMA의 증가, 중합개시제의 증량 및 무전해 니켈도금 실시 등은 압축탄성률 및 파괴강도에 동시에 큰 영향을 미침을 알 수 있었다.

Monodisperse polymer particles were prepared via one-step seeded polymerization using PMMA seed particles and HDDA (or EGDMA) as crosslinking monomer. For the study, the effects of 1) the ratio of the absorbed monomer or monomer mixture to the seed polymer particles (swelling ratio), 2) the ratio of EGDMA in absorbed monomer mixture, 3) the dosage of initiator, and 4) electroless Ni plating on the variation of mechanical properties of monodisperse polymer particles, such as recovery rate, K-values, breaking strength and breaking displacement, were investigated by using MCT (micro compression test). It was observed that monomer swelling ratio influenced only breaking strength, but EGDMA ratio in monomer mixture, dosage of initiator and electroless Ni plating affected both K-values and breaking strength.

Keywords:monodisperse polymer particle;swelling ratio;seeded polymerization;molecular weight;mechanical property

[References]

Watanabe I, Fujinawa T, Arifuku M, Fujii M, Gotoh Y, 9th Int'l Symposium on Advanced Packing Materials (2004)
Joshi R, Microelectron. J., 29, 343 (1998)
Chang S, Jou J, Hsieh A, Chen T, Chang C, Wang Y, Hung C, Microelectron. Reliab., 41, 2001 (2001)
Rizvi M, Chan Y, Sharif A, Solder. Surf. Mt. Tech., 17, 40 (2005)
Sarkar G, Mridha S, Chong T, Yuen W, Kwan S, J. Mater. Process. Technol., 89, 484 (1999)
Chan Y, Luk D, Microelectron. Reliab., 42, 1185 (2002)
Chan Y, Luk D, Microelectron. Reliab., 42, 1195 (2002)
Wu Y, Alam M, Chan Y, Wu B, Microelectron. Reliab., 44, 295 (2004)
Seppala A, Ristolainen E, Microelectron. Reliab., 44, 639 (2004)
Uddin M, Alam M, Chan Y, Chan H, Microelectron. Reliab., 44, 505 (2004)
Goward JM, Whalley DC, Williams DJ, Microelectronics International, 37, 55 (1995)
Whalley DC, Mannan SH, Williams DJ, Assembly Autom., 17, 66 (1997)
Oguibe CN, Mannan SH, Whalley DC, Williams DJ, IEEE Trans. Compon. Packag. Manuf. Technol. Part B Adv. Packag., 21, 235 (1998)
Saiuchi K, Kohara M, Yamada K, Kanki K, US Patent 5,486,941 (1996)
Saiuchi K, Kohara M, Yamada K, Kanki K, US Patent 5,615,031 (1997)
Park JK, Chung PM, Korea Patent 10-2004-002183 (2004)
Kim DO, Jin JH, Oh SH, Polym.(Korea), 30(1), 50 (2006)
Iacovangelo CD, Plat. Surf. Finish., 82, 77 (1995)
Hagiwara K, Watanabe J, Honma H, Plat. Surf. Finish., 84, 74 (1997)
Motizuki I, Izawa K, Watanabe J, Honma H, Trans. IMF, 77, 41 (1997)

[Referenced By]

[1] Watanabe I, Fujinawa T, Arifuku M, Fujii M, Gotoh Y, 9th Int'l Symposium on Advanced Packing Materials (2004)

[2] Joshi R, Microelectron. J., 29, 343 (1998)

[3] Chang S, Jou J, Hsieh A, Chen T, Chang C, Wang Y, Hung C, Microelectron. Reliab., 41, 2001 (2001)

[4] Rizvi M, Chan Y, Sharif A, Solder. Surf. Mt. Tech., 17, 40 (2005)

[5] Sarkar G, Mridha S, Chong T, Yuen W, Kwan S, J. Mater. Process. Technol., 89, 484 (1999)

[6] Chan Y, Luk D, Microelectron. Reliab., 42, 1185 (2002)

[7] Chan Y, Luk D, Microelectron. Reliab., 42, 1195 (2002)

[8] Wu Y, Alam M, Chan Y, Wu B, Microelectron. Reliab., 44, 295 (2004)

[9] Seppala A, Ristolainen E, Microelectron. Reliab., 44, 639 (2004)

[10] Uddin M, Alam M, Chan Y, Chan H, Microelectron. Reliab., 44, 505 (2004)

[11] Goward JM, Whalley DC, Williams DJ, Microelectronics International, 37, 55 (1995)

[12] Whalley DC, Mannan SH, Williams DJ, Assembly Autom., 17, 66 (1997)

[13] Oguibe CN, Mannan SH, Whalley DC, Williams DJ, IEEE Trans. Compon. Packag. Manuf. Technol. Part B Adv. Packag., 21, 235 (1998)

[14] Saiuchi K, Kohara M, Yamada K, Kanki K, US Patent 5,486,941 (1996)

[15] Saiuchi K, Kohara M, Yamada K, Kanki K, US Patent 5,615,031 (1997)

[16] Park JK, Chung PM, Korea Patent 10-2004-002183 (2004)

[17] Kim DO, Jin JH, Oh SH, Polym.(Korea), 30(1), 50 (2006)

[18] Iacovangelo CD, Plat. Surf. Finish., 82, 77 (1995)

[19] Hagiwara K, Watanabe J, Honma H, Plat. Surf. Finish., 84, 74 (1997)

[20] Motizuki I, Izawa K, Watanabe J, Honma H, Trans. IMF, 77, 41 (1997)