Experiments were performed to evaluate the evaporative heat transfer characteristics of spray cooling of water on plain and micro-structured silicon surfaces at very low spray mass fluxes. The textured surface is made of an array of square micro-studs. It was found that the Bond number of the microstructures is the primary factor responsible for the heat transfer enhancement of evaporative spray cooling on micro-structured silicon surface in the present study. A qualitative study of evaporation of a single water droplet on plain and textured silicon surface shows that the capillary force within the microstructures is effective in spreading the deposited liquid film, thus increasing the evaporation rates. Four distinct heat transfer regimes, which are the flooded, thin film, partial dryout, and dryout regimes, were identified for evaporative spray cooling on micro-structured silicon surfaces. The microstructures provided better cooling performance in the thin film and partial dryout regime and higher liquid film breakup heat flux, because more water was retained on the heat transfer surface due to the capillary force. Heat transfer coefficient and temperature stability deteriorated greatly once the liquid film breakup occurred. The liquid film breakup heat flux increases with the Bond number. Effects of surface material, system orientation and spray mass flux were also addressed in this study. (c) 2005 Elsevier Ltd. All rights reserved.