Gold layers were prepared on poly(ethylene terephtalate) substrate by diode sputtering and vacuum evaporation. The mean layer thickness was determined by atomic absorption spectroscopy. Sheet electrical resistance and reflection of electromagnetic waves were used for the characterization of layers. Surface morphology of the layers was determined using atomic force and scanning electron microscopy. While the sputtering was found to proceed with two different rates, the vacuum evaporation proceeds at a constant rate. Rapid decrease of the sheet resistance was observed during sputtering, depending on the layer thickness, in contrast to vacuum evaporation. This can be due to different mechanisms of the An deposition. According to the measured reflection of electromagnetic waves, the layers prepared by both techniques, i.e., sputtering and vacuum evaporation, are discontinuous for thicknesses below 4 nm, continuous but heterogeneous for thickness from 4 to 10 nm, and continuous and homogeneous for thickness above10 nm. The morphology of the layers prepared by vacuum evaporation does not depend on the layer thickness. Rounded clusters are observed on the surface of the evaporated layers. The layers prepared by sputtering exhibit significantly different morphology with much smaller, pointed clusters. (c) 2005 Wiley Periodicals, Inc.