Copper plating has been industrially applied in many parts for a long time. In recent because of high density of electronic component and subminiaturization more improved plating method became to be needed. In this experiment, We set purpose to improve plating method by change the flow rate. checking the shape of plated copper and decreasing the thickness deviation. And we could decrease the thickness deviation by making self-plating device and then using this device which uses Eductor nozzles that can change flow rate.