Soft lithography has been widely used in stamping and printing processes for microfabrication as a low cost alterriative to photolithography. However, conventional poly(dimethyl)siloxane (PDMS) stamp materials have limitations, especially in the submicrometer range, due to their low physical toughness and requirements for thermocuring. A new version of functional stamp materials with adjustable physical toughness has been developed for advanced soft lithography. We thus demonstrate here its photopatternability and nanoresolution soft lithography, which have proven to be difficult using commercial stamp materials.