The widespread use of titanium aluminide alloys will require effective joining techniques for primary fabrication and repair. One such technique is Transient Liquid Phase (TLP) bonding, which has been used to join titanium aluminide alloys. A successful TLP bonding process uses a copper-containing composite interlayer and thus introduces a small amount of copper into the alloy. Although even relatively small alloying additions can be detrimental to the oxidation resistance of titanium aluminide alloys, the amount of copper added to the alloy during the TLP bonding process has previously been shown to be neutral or beneficial to the isothermal oxidation resistance of the alloy. In this paper, a small amount of copper introduced during TLP bonding is shown to have no detrimental effect on the cyclic oxidation of Ti-48 at% Al-2 at% Cr-2 at% Nb. (c) 2005 Springer Science + Business Media, Inc.