Previous Article Next Article Table of Contents Journal of Materials Science, Vol.40, No.18, 4963-4965, 2005 DOI10.1007/s10853-005-3869-4 Export Citation Sequential deposition of copper/alumina composites Wang X, Ma J, Maximenko A, Olevsky EA, Stern MB, Guenin BM Please enable JavaScript to view the comments powered by Disqus.
