Deposition of copper thin films was achieved by a photocatalytic reaction of site-selectively adsorbed TiO2 nanocrystals for direct fabrication of copper circuit patterns on glass substrates. The nanocrystal monolayers absorbed on hydrophobic surface templates serve as an effective photocatalyst, producing metallic copper and formic acid via oxidation of methanol in solution. The formic acid generated has also been suggested to serve as an electron donor that accelerates copper deposition through a UV-mediated autocatalytic reaction, even after nanocrystals are embedded into the grown copper films. The thickness of the deposited copper films was easily controlled by varying the UV irradiation time, irradiation power, and initial concentration of methanol as a hole scavenger. The process presented herein provides an effective methodology for resist-free, direct metallization of insulating substrates.