A nanoporous alumina template made from a multilayer metal film structure has been developed that allows for the in situ removal of the electrically insulating alumina barrier layer, exposing a Pt electrode at the pore bases. This barrier-free nanoporous system is of great use for dc electrodeposition of a wide variety of materials in the alumina pores. This work in particular describes the development of a multilayer thin film precursor consisting of a Si substrate with thin Pt and Ti and a thicker Al layer in that order. After the Al is anodized, producing the porous alumina, the resulting TiO2 is selectively removed at the base of the alumina pores exposing the Pt electrode. The metals in the precursor perform different roles in the fabrication and allow the alumina template to be fabricated directly on the final substrate with no film transfer technique involved. This allows Si to be used as the substrate, which could then include electronic circuitry. Several techniques are used to analyze the resulting template. (c) 2005 The Electrochemical Society.