The primary and secondary current distributions for the particle incorporation process during electrocodeposition of a metal film were numerically studied. The growth of an electrodeposited film along the electrode is governed by the local current density that is affected by the presence of a nonconducting particle. It was assumed that the effect of lateral displacement of the fluid between a particle and an electrode is negligible. The level set method was used to track the moving interface as it grows around the particle, and the Laplace equation for the electrical potential was solved by a finite-element method. For a primary current distribution, voids beneath the particle are generated due to the characteristics of the potential distribution, so that the metallic film does not grow along the particle surface. The resistance increment due to the presence of the particle was compared for the cases of stationary and growing metallic films. A small void on top of the particle when incorporated by metal is observed with a secondary current distribution. (c) 2005 The Electrochemical Society.