In the present study, bismuth telluride compound thin film was grown by means of electrochemical atomic layer epitaxy (ECALE) with an automated thin layer flow cell deposition system. The dependence of the Bi and Te deposition potentials on Pt electrode was studied. Because developing a contact potential between the substrate and the growing semiconductor, the deposition potential adjustment is necessary for the first 30 or more cycles of each component. The dependence of the deposit as a function of the deposition potential adjustment slope has been investigated. The results show that an excess elemental Bi existed at a slope of -2 mV/p (p indicates per cycle), indicating that this is a lack of deposition at the potential. Single-phase Bi2Te3 compound could be obtained between -4 and -6 mV/p. Bi2Te3 and Bi4Te3 coexistence is observed at a slope of -10mV/p. The EDS data indicates that the stoichiometry of compound is consistent with XRD result. SEM studies show that the deposits are inhomogeneous and have an micron sized particles morphology. (c) 2005 Elsevier Ltd. All rights reserved.