Journal of Industrial and Engineering Chemistry, Vol.11, No.6, 876-882, November, 2005
Nickel Electroplating on Copper Substrate in Plating Solution Containing High-Density CO2
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In this work, we investigated the effects that CO2 concentration, electric resistance, and solubility have on the characteristics of a nickel film in an electroplating system containing high-density CO2. CO2 was added at concentrations below 50 CO2 wt% to maintain the resistance at 20 Ω. Inflection was observed at 45 ℃ in the solubility curve of nickel particles; the electric resistance decreased upon increasing the temperature under 45 ℃, but increased over 45 ℃. Electric resistance reached ca. 24 Ω, the lowest value, at 16 MPa and 45 ℃. Methyl alcohol was used as an entrainer. The electric resistance reached 20 Ω when adding 4 wt% of methyl alcohol was added; synergistic effect of adding 4 wt% methyl alcohol was ca. 15%.
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