Recent work has shown that molecular nanolayers (MNLs) are attractive candidates for isolating and enhancing adhesion of Cu/SiO2 interfaces for sub 100 nm integrated circuits. Here, we report the effects of solution concentration and SiO2 surface treatment on the adhesion of Cu/SiO2 interfaces treated with organosilane MNLs with two different nitrogen-containing termini. MNLs from 5 mM concentration solution form monolayers and enhance adhesion, while 50 mM solutions form multilayers via unregulated self-polymerization, leading to inferior adhesion. Electron spectroscopy of fracture surfaces reveals that the Cu/MNL interface is. the weakest link. (C) 2005 American Vacuum Society.