Epoxy adhesives are used in CMOS assembly. In this study, the preparation of epoxy adhesive for fast curing at low temperature was investigated. The cure behavior of epoxy adhesive was measured using a DSC. The cure behavior of epoxy adhesive was largely dependent on the compounding method of raw materials. The crack on surface of lens not occurred fast cure condition at low temperature. Compared with box oven, conveyor oven provided faster heat transfer on adhesive.