This paper demonstrates that micropatterns of copper films can be fabricated by selective electrochemical etching of copper using microcontact printing of self-assembled monolayers (SAMs). The elastomeric stamps which have microstructures on their surfaces are made out of polydimethylsiloxane and then are inked with a solution of an alkanethiol in ethanol. SAMs of alkanethiol are patterned on the copper films by contacting stamps with the substrates. The patterned substrates are etched electrochemically in an electrolyte. SAMs of alkanethiol act as an electrochemical barrier leading to selective etching of copper films. Microstructures of copper with dimensions as small as 1.5 mum have been produced using this procedure. This method shows the capability of fabricating simple structures on a scale comparable to UV photolithography which produces printed circuits of copper for the semiconductor industry. (C) 2004 The Electrochemical Society.