Previous Article Next Article Table of Contents Journal of Materials Science, Vol.39, No.3, 1095-1099, 2004 DOI10.1023/B:JMSC.0000012953.36499.73 Export Citation Kinetics of interface reaction and intermetallics growth of Sn-3.5Ag-0.7Cu/Au/Ni/Cu system under isothermal aging Shi XQ, Kwan HF, Nai SML, Lim GH Please enable JavaScript to view the comments powered by Disqus.
