A simulation model was devised to predict the in-plane displacement (IPD) of an extreme ultraviolet mask during a chucking operation with friction. The model is based on the theory of two-dimensional plane stress, and employs time evolution to predict the dynamic response of IPD. The IPD for a stepwise chucking force was found to reach a stationary state in 100 mus, after the vibrations attenuated. With regard to glass ceramic materials for the substrate, the effect of the coefficient of friction on IPD during a chucking operation was investigated. The IPD was found to decrease as the pattern density decreased. In order to reduce the IPD due to chucking, it is necessary to reduce the stress of the multilayer and absorber films, and to employ a substrate material with a high Young's modulus. (C) 2003 American Vacuum Society.