This article employs a molecular dynamics (MD) simulation approach to investigate the influence of beveled angles on the filling mechanisms of a dual damascene process. The objective of the present study is to propose a method that overcomes the problem of incomplete via filling associated with the traditional dual damascene process. The simulation incorporates three separate MD models, namely the dual via model, the deposition model, and the potential model. Furthermore, the simulation adopts the thermal control layer marching algorithm to increase the accuracy of the solution and to reduce the computational time. The present results indicate that the introduction of beveled angles at the upper via corners has a detrimental impact upon the filling of the lower via at moderately low via-radius ratios (1.75, 2.0). At a via-radius ratio of 1.75, the filling morphology changes from one-of complete filling to one with trapped voids within the via when beveled angles are introduced, while at the slightly larger via-radius ratios of 2.0 and 2.5, the voids in the lower via are observed to grow in size. It is noted that the influence of beveled angles at the upper via corners on the lower via filling becomes less significant as the via-radius ratio increases (2.5, 3.0). In general, it is found that the introduction of beveled angles at the lower via corners is beneficial to the filling coverage of the lower via, but has no impact upon the filling of the upper via. (C) 2003 American Vacuum Society.