화학공학소재연구정보센터
홈 로그인 로그아웃 연락처 사이트맵
Journal of the Korean Industrial and Engineering Chemistry, Vol.15, No.4, 417-423, June, 2004
Export Citation
알킬그룹으로 도핑된 폴리아닐린과 그 유도체의 합성 및 특성
Synthesis and Characterization of Polyaniline and Its Derivatives Doped with Alkyl Groups
홍장후†
  • 서울산업대학교 정밀화학과, 서울 139-743
Jang-Hoo Hong†
  • Department of Fine Chemistry, Seoul National University of Technology, Seoul 139-743, Korea
E-mail:
초록
폴리아닐린에 극성 치환기의 도입과 친핵성 첨가반응에 의한 도핑으로 극성 용매에 용해성을 갖는 dialkylsulfate [DAS: dimethylsulfate (DMS), diethylsulfate (DES), dipropylsulfate (DPS)]로 도핑된 폴리아닐린과 그 유도체를 합성하였다. DAS로 도핑된 폴리아닐린(PANI-DAS)은 HCl로 도핑된 폴리아닐린에 비하여 160 ℃에서 열적 안정성이 우수함을 볼 수 있었다. PANI-DAS는 극성 용매내에서 4 ~ 8 wt%/vol, DMS가 도핑된 폴리에톡시아닐린(PEtOANI-DAS)은 다양한 알콜 용매 내에서 5 ~ 10 wt%/vol의 용해도를 보여 주었다. PANI-DMS, PEtOANI-DMS 필름의 전기전도도는 1.0 ~ 2.3 S/cm, 10-2 ~ 10-4 S/cm을 나타내었다. 극성 용매 내에서의 용해도 증가 현상을 극성 sulfonate group, 극성 치환제, 극성 용매간의 상호 작용으로 설명하였다.
Polyaniline and its derivatives doped with dialkylsulfate [DAS: dimethylsulfate (DMS), diethylsulfate (DES), dipropylsulfate (DPS)] soluble in polar solvents were synthesized by incorporating polar functional groups in the polyaniline backbone, and doped by nucleophilic addition. Polyaniline doped with DAS (PANI-DAS) showed improved thermal stability, upon heat treatment at 160 ℃, compared to that of HCl doped polyaniline. Solubilities of PANI-DMS powder in polar solvents and polyethoxyaniline doped with DMS (PEtOANI-DMS) powder in various alcohols were observed in the range of 4 ~ 8 wt%/vol. and 5 ~ 10 wt%/vol., respectively. The electrical conductivities of PANI-DMS and PEtOANI-DMS films appeared in the range of 1.2 ~ 2.3 S/cm and 10-2 ~ 10-4 S/cm, respectively. The improved solubility in organic polar solvents was due to the interactions between the polar sulfonate group, polar substituent and polar solvents.
Keywords:polyaniline;polyethoxyaniline;dialkylsulfate;nucleophilic addition reaction
  1. Macdiarmid AG, Epstein AJ, J. Chem. Soc.-Faraday Trans., 88, 317 (1989)
  2. Vikki T, Pietila LO, Osterholm H, Ahjopalo L, Takala A, Toivo A, Levon K, Passiniemi P, Ikkala O, Macromolecules, 29(8), 2945 (1996) 
  3. Gettinger CL, Heeger AJ, Pine DJ, Cao Y, Synth. Met., 74, 81 (1995) 
  4. Yue J, Wang ZH, Cromack KR, Epstein AJ, Macdiarmid AG, J. Am. Chem. Soc., 113, 2665 (1991) 
  5. Yue J, Epstein AJ, J. Am. Chem. Soc., 112, 2800 (1990) 
  6. Ginder JM, Epstein AJ, Phys. Rev., B, Condens. Matter, 41, 10674 (1990)
  7. Ginder JM, Epstein AJ, Macdiarmid AG, Solid State Commun., 72, 987 (1989) 
  8. Kuramoto N, Genies EM, Synth. Met., 68, 191 (1995) 
  9. Yang CY, Heeger AJ, Cao Y, Synth. Met., 79, 27 (1996) 
  10. Andretta A, Cao Y, Chiang JC, Heeger AJ, Smith P, Synth. Met., 26, 383 (1988) 
  11. Cao Y, Andreatta A, Smith P, Heeger AJ, Polymer, 30, 2305 (1989) 
  12. Cao Y, Treacy GM, Smith P, Heeger AJ, Appl. Phys. Lett., 60, 2711 (1992) 
  13. Lee KH, Heeger AJ, Cao Y, Synth. Met., 72, 25 (1995) 
  14. MacDiarmid AG, Epstein AJ, Synth. Met., 69, 85 (1994)
  15. U.S. Patent, 5,232,631 (1993)