Low dielectric constant materials are critical to meeting the demand for continual reduction in feature sizes and increase in interconnect density required for future high-speed microelectronic devices. Polymers based on functionalized norbornenes are inherently attractive for these applications as they exhibit good electrical properties such as a low dielectric constant and appealing mechanical properties. Although polynorbornenes inherently possess properties that are attractive for microelectronics packaging, films of these polymers are not solvent-resistant. Solvent-resistant crosslinked films can be attained by generation of acid species to promote cationic crosslinking of epoxide side groups. This article is the second part of a two-part study investigating the crosslinking of a copolymer of decyl norbornene and epoxide norbornene. In the first part of this study, it was proposed that epoxide decomposition reactions are also possible at cure temperatures greater than 160degreesC. This decomposition mechanism results in the complete loss of crosslinkable epoxide groups while leaving the norbornene backbone intact. Although crosslinking and decomposition reactions have independent mechanisms, both reactions directly affect the level of crosslinking. In this part of the study, the solvent swelling behavior, tensile modulus, elongation to break, and residual stress were investigated for polymer films cured under various conditions to validate the proposed mechanisms. The trends observed with these properties are consistent with the counteracting nature of epoxide crosslinking and decomposition reactions. (C) 2003 Wiley Periodicals, Inc. J Appl Polym Sci 91: 1020-1029, 2004.