Direct Ni electrodeposition on insulating polymers by the so-called PLATO technique is studied and the application of this technique for microstructured metallization is investigated. Propagation behavior, surface morphology, conductivity and thickness of a deposited metal layer are characterized using microscopy, AFM, four-point conductivity and XPS sputter measurements. Two layers are formed during metal deposition: primary layer and secondary layer. Both layers propagate with constant rates during the first 60 s and the propagation rates are influenced by the metallization potential. The primary layer has hemispherical morphology, low conductivity and an uneven thickness of about 25-100 nm. The secondary layer has the repetition morphology of the primary and higher roughness (R-a(prim) = 40 nm, R-a(sec) = 150 nm), higher conductivity (sigma(sec)/sigma(prim) = 10(8)/10(10)) and a thickness of 100-200 nm. The high lateral propagation rate of the metal strip during metal deposition offers possibilities for metallization of insulating microstructures. Routines for microstructured metallization using PLATO technique are proposed and examples for the applications are demonstrated. (C) 2003 Elsevier Ltd. All rights reserved.