A fast running computational algorithm based on the volume averaging technique (VAT) is developed to simulate conjugate heat transfer process in an electronic device heat sink. The goal is to improve computational capability in the area of heat exchangers and to help eliminate some of empiricism that leads to overly constrained designs with resulting economic penalties. VAT is tested and applied to the transport equations of airflow through an aluminum (Al) chip heat sink. The equations are discretized using the finite volume method (FVM). Such computational algorithm is fast running, but still able to present a detailed picture of temperature fields in the airflow as well as in the solid structure of the heat sink. The calculated whole-section drag coefficient, Nusselt number and thermal effectiveness are compared with experimental data to verify the computational model and validate numerical code. The comparison also shows a good agreement between FVM results and experimental data. The constructed computational algorithm enables prediction of cooling capabilities for the selected geometry. It also offers possibilities for geometry improvements and optimization, to achieve higher thermal effectiveness. (C) 2003 Elsevier Science Ltd. All rights reserved.