Maleimide modified epoxy compounds were prepared through reacting N-(4-hydroxylphenyl)maleimide (HPM) with diglycidylether of bisphenol-A. Triphenylphosphine and methylethylketone were utilized in the reactions as a catalyst and a solvent, respectively. The resulting compounds possessed both oxirane ring and maleimide group. The kinetics of the curing reactions of the maleimide-epoxy compounds and amine curing agents, 4,4-diaminodipheylmethane (DDM) and dicyandiamide (DICY), were studied. Incorporation of maleimide groups into epoxy resins provided cyclic imide structure and high cross-linking density to the cured resins, to bring high glass transition temperatures (179 degreesC) and good thermal stability (above 380 degreesC) to the cured resins. High char yields in the thermogravimetric analysis and high limited oxygen index values (25.5-29.5) were also observed for the cured resins to impy their good flame retardance.