화학공학소재연구정보센터
International Journal of Heat and Mass Transfer, Vol.44, No.12, 2261-2275, 2001
Thermal and flow analysis of a heated electronic component
This work presents the application of a newly developed numerical method to study the Bow past a heated electronic component. The vortex shedding mechanism is described with the aid of a large-scale flow structure. The Bow structure is also presented by streakline distributions. The computed pressure and heat flux distributions: along the surface of the electronic component are discussed. Their relations with the vortex shedding are also presented.