For an epoxy resin waterborne system mixed with a curing agent, butanone oxime blocked 4,4'-methylenediphenyldiisocyanate, curing-reaction-induced residual stress generation was in-situ measured in thin films adhered on silicon substrates. This measurement was carried out with varying composition as well as curing temperature, time and step. The residual stress was dependent upon the composition, the deblocking process of the curing agent and the curing condition. In addition, cured films were examined by FT-IR spectroscopy, differential scanning calorimetry, and thermogravimetric analysis.