Flying-probe mechanical test systems which detect opens and shorts in electrical networks within a multichip module substrate by measuring the capacitance of network elements have found application within the manufacturing industry. The feasibility of a contactless capacitance measurement method using an electron beam is reported here. Compared to mechanical probers, an electron beam capacitance tester could have higher throughput, test smaller features, and eliminate the possibility of probe damage to substrates. The test method is easily implemented as it employs a low voltage probe beam with a small deflection range, electron flood guns, a arid or electrode above the substrate, and an induced current detector. The capacitance between the node under test and the conductive plane is measured (indirectly) as the node is charged by the probe beam. Capacitance measurement to the accuracy required to detect opens and shorts has been demonstrated.