Previous Article Next Article Table of Contents Journal of Materials Science Letters, Vol.20, No.6, 559-562, 2001 DOI10.1023/A:1010940803210 Export Citation Study of electroplated copper thin film and its interfacial reactions in the EPCu/IMPCu/IMPTaN/SiO2/Si multilayer structure Latt KM, Lee K, Lee YK Please enable JavaScript to view the comments powered by Disqus.
