In older to introduce next generation lithography (NGL) into practical use, developing a production-worthy exposure tool is as important as developing a proof-of-concept system and mask technology. The progress of the exposure tool can be used as a measure of the status of each NGL choice. Canon has been focusing on the development of a proximity x-ray lithography (PXL) system for volume production use since the start of development. This has included development of magnification correction, development of a high-seed wafer stage, improvement of illumination intensity, extension of process latitude in the alignment system design, and development of an accurate environment control system. For example, we introduced a new method, using mechanical deformation of the mask, for magnification correction. We also developed a new wafer stage based on a field proven-high-speed wafer stage from our current optical lithography systems. A stepping time (including settling time) of less than 400 ms for a 50 mm step in a low-pressure helium environment was achieved. These achievements have been integrated into our volume production tool: the XRA-1000 x-ray stepper. The XRA-1000 has been installed in ASET and it will be used as the means for other process module development. Its results will demonstrate that PXL technology is the most practical NGL technology for volume production.