Previous Article Next Article Table of Contents Journal of Vacuum Science & Technology A, Vol.19, No.6, 2974-2978, 2001 DOI10.1116/1.1405511 Export Citation Chemical vapor deposition of an electroplating Cu seed layer using hexafluoroacetylacetonate Cu(1,5-dimethylcyclooctadiene) Lee WH, Ko YK, Byun IJ, Seo BS, Lee JG, Reucroft PJ, Lee JU, Lee JY [Referenced By] Please enable JavaScript to view the comments powered by Disqus.
