Void formation in stoichiometric NiAl was studied through controlled heat treatments and microstructural characterization through transmission electron microscopy. Voids were observed to form at temperatures as low as 400 degreesC, but were noted to dissolve during annealing at 900 degreesC. Two distinct void shapes, cuboidal and rhombic dodecahedral, were observed, often at the same annealing temperature. At higher temperatures (greater than or equal to 800 degreesC) extensive dislocation climb, rather than void formation, was noted. The relative incidence of void formation and dislocation climb can be related to the mobility of vacancies at each annealing temperature. The shape of void type is described in terms of their relative surface energy and mode of nucleation.