화학공학소재연구정보센터
Thin Solid Films, Vol.385, No.1-2, 22-28, 2001
Non-destructive evaluation of delamination in ceramic thin films on metal substrates by scanning electron microscopy
A novel technique based on scanning electron microscopy (SEM) has been used to estimate the amount of delamination in thin ceramic 'splats' obtained by quenching from the liquid state on metal substrates. It is in the nature of these severely quenched materials to crack heavily and delaminate at crack edges. SEM images of the splats exhibit a contrast delineating the decohered regions of the splat. Insulating thin films on metal substrates exhibit a composite conductivity that is dependent on contact at the interface. The influence of spatially varying conductivity on charging in the insulating film causes variations in the emission current intensities used for generating images. Analysis of image contrast provides a non-destructive measure of delamination.