Thin plasma polymer films were deposited from a mixture of dichloro(methyl)phenylsilane (DCMPS) vapor and gaseous hydrogen in an rf (13.56 MHz) capacitive coupling deposition system on pieces of silicon wafers. Some of samples were annealed in a vacuum to temperatures ranging from 450 to 700 degreesC. The chemical composition, structure, and surface morphology of the annealed samples and those stored in air at room temperature were studied by FTIR, XPS, SEM, and optical microscopy. The thermal stability and decomposition of the plasma polymer with increasing temperature were characterized using thermogravimetry together with mass spectrometry. The plasma polymer was stable to a temperature of 300 degreesC. Above that temperature, the material started to decompose together with additional crosslinking due to the incorporation of extra oxygen atoms forming new siloxane bonds. The plasma polymer was tough at room temperature but much more brittle after annealing.