Dipping experiments of Ni foils in molten tin were made in the temperature range, 280-310 degrees C. In addition, experiments were conducted while passing a constant current through the system, the foils being used as electrodes. In SEM - EDS observations and analysis the Ni3Sn4 equilibrium intermediate phase was found to grow both as a layer at the solid/liquid interface and as platelets in the melt. Growth kinetics were found to be influenced by the dissolution of Ni in the melt. The voltage between the electrodes vs. time (V(t) curve), measured in-situ, was found to conform to SEM observations. The V(t) curves permit a qualitative evaluation of the layer growth process.