Ln this work we present a new approach for solving the tradeoff between breakdown capability and on state resistance for Power-MOS devices. Therefore we use a vertical transistor on an epitaxial layer. This concept allows the adjustment of the breakdown voltage due to the thickness of the epi-layer separately from the on-state resistance, which is defined by the vertical transistor. The transistor was fabricated by means of MBE, which allows very small channel length and doping control on atomistic scale. Devices with breakdown voltages between 12 V and 40 V were produced. It is also shown that the usage of local channel doping instead of homogenous doping in the switching transistor reduces the on state resistance of the device significantly.