Polymer(Korea), Vol.25, No.2, 218-225, March, 2001
화학환원 니켈도금 처리에 따른 탄소섬유 표면 및 복합재료의 기계적 계면 특성
Studies of Electroless Ni-Plating on Surface Properties of Carbon Fibers and Mechanical Interfacial Properties of Composites
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초록
복합재료의 기계적 계면 특성을 향상시키기 위하여 탄소섬유에 무전해 니켈도금 표면처리를 하였으며, 표면처리된 PAN계 탄소섬유를 에폭시수지에 함침시켜 프리프레그법으로 일방향 탄소섬유/에폭시수지 복합재료를 제조하였다. 본 연구에서는 무전해 니켈도금으로 유기된 취성-연성 전이 특성을 가지는 Ni-P 합금의 양에 따른 복합재료의 층간전단강도(ILSS)와 충격강도의 차이를 조사하였다. 또한, 탄소섬유 표면 특성의 변화를 X-ray photoelectron spectroscopy(XPS)로 측정하였다. 그 결과, 무전해 니켈도금된 탄소섬유 표면의 O1s/C1s비 또는 니켈(Ni)과 인(P)이 증가되었으나 ILSS의 향상에는 큰 영향을 미치지 못하는 것을 알 수 있었다. 그러나, 무전해 니켈도금으로 탄소섬유 표면에 도입된 Ni-P 합금은 복합재료의 연성에 따른 충격강도를 향상시키는 것을 확인할 수 있었다.
The electroless plating of a metallic nickel on PAN-based carbon fiber surfaces was carried out to improve mechanical interfacial properties of the carbon fiber/epoxy resin composites which were unidirectionally fabricated by a prepregging method. In this work, the influence of Ni-P alloy concentration showing brittle-to-ductile transition was investigated on interlaminar shear strength (ILSS) and impact strength of the composites. The surface properties of carbon fibers were also measured by X-ray photoelectron spectroscopy (XPS). As the result, the O(1s)/C(1s) ratio or Ni and P amounts were increased with increasing electroless nickel plating time but the ILSS were not significantly improved, However, the impact properties was significantly improved in the presence of Ni-P alloy in the carbon fiber surface, resulting in an increase of the ductility of the composites.
Keywords:carbon fibers;epoxy resin;electroless Ni-plating;interlaminar shear strength;impact strength;ductility
- Smith WS, "Engineered Materials Handbook", vol. 1, ASM International, Ohio (1987)
- Donnet JB, Bansal RC, "Carbon Fibers", 2nd ed., Marcel Dekker, New York (1990)
- Park SJ, Cho MS, Lee JR, Polym.(Korea), 22(6), 972 (1998)
- Park SJ, Donnet JB, J. Colloid Interface Sci., 206(1), 29 (1998)
- Park SJ, Lee JR, J. Mater. Sci., 33(3), 647 (1998)
- Park SJ, "Interfacial Forces and Fields: Theory and Applications", ed. by J.P. Hsu, chap. 9, Marcel Dekker, New York (1999)
- Weitzsacker L, Ming X, Drzal LT, Surf. Interface Anal., 25, 53 (1997)
- Ibarra L, Macias A, Palma E, J. Appl. Polym. Sci., 61(13), 2447 (1996)
- Park SJ, Papirer E, Donnet JB, J. Chim. Phys., 59, 203 (1994)
- Tetsuji N, Hiroshi S, Fujio A, Masatoshi O, J. Nucl. Sci. Technol., 32, 369 (1995)
- Crane RV, Krukonis VJ, Ceram. Bull., 54, 184 (1974)
- Parker K, Woil R, "Electroless Plating: Fundamentals and Applications", American Electroplaters and Surface Fishers Society, Orlando (1990)
- Park SJ, Jang YS, Lee JR, Kim JS, Polym.(Korea), 24(5), 721 (2000)
- Ang LM, Andy TS, Xu GQ, Tung CH, Zhao S, Wang JLS, Chem. Mater., 11, 2115 (1999)
- Charrier JM, "Polymeric Materials and Processing", Hanser, New York (1990)
- Han KP, Fang JL, J. Appl. Electrochem., 26(12), 1273 (1996)
- Hage E, Costa SF, Pessan LA, J. Adhes. Sci. Technol., 11(12), 1491 (1997)
- Dilsiz N, Ebert E, Weisweiler W, Akovali G, J. Colloid Interface Sci., 170(1), 241 (1995)
- Ahearn C, Marino F, Carbon, 34, 239 (1996)