Polyimide 전구체에 따른 Polyimide/Polyamideimide 복합체의 형태학 및 인장 특성

김진봉; 최윤희; 임병탁; 박준상; Jin-Bong Kim; Yun-Hee Choi; Byoung-Tak Yim; Jun-Sang Park

Polymer(Korea), Vol.25, No.2, 160-167, March, 2001

Export Citation

Polyimide 전구체에 따른 Polyimide/Polyamideimide 복합체의 형태학 및 인장 특성

Morphology and Tensile Properties of Polyimide/Polyamideimide Composites from Different Polyimide Precursors

김진봉^†, 최윤희¹, 임병탁², 박준상²

전남대학교 고분자공학과
¹금호산업
²금호석유화학

Jin-Bong Kim^†, Yun-Hee Choi¹, Byoung-Tak Yim², and Jun-Sang Park²

Department of Polymer Engineering, Chonnam National Univ., Gwangju 500-757, Korea
¹Kumho Industry Ltd., 555, Sochon-dong, Kwangsangu, Gwangju, Korea
²Kumho Petroleum Chmical Co., Hwam-dong, Yuseung, Taejon, Korea

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초록

특성이 서로 다른 polyimide(PI) 전구체와 polyamideimide(PAI) 블렌드물을 solvent casting법으로 제조한 후 열처리하여 다양한 조성의 PI/PAI 복합체를 제조하였다. Poly(amic acid)(PAA)를 전구체로 사용한 PAA/PAI 복합체의 경우 산-염기에 의한 ionic force 또는 수소 결합에 의한 분자간력으로 인하여 좋은 혼화성을 나타냈지만, poly(amic dimethyl ester)(PAME)를 전구체로 사용한 PAME/PAI 복합체는 약화된 분자간력으로 인하여 상분리가 뚜렷하게 발생함을 편광 현미경을 통해 관찰하였다. 전구체의 종류에 관계없이 이미드화된 복합체의 인장 탄성 계수는 선형치보다 증가하였으나 PAI 매트릭스 영역에서의 인장강도 및 전 혼합 조성에서의 파단 변형률은 감소하였다. 상대적으로 낮은 유리 전이 온도를 가진 PAI에 의한 가소화 때문에 열적 이미드화 과정 중에 PI 분자쇄의 재정렬이 촉진됨을 편광현미경 및 X-선 회절 결과로부터 확인하였다.

The various compositions of polyimide (PI)/polyamideimide (PAI) composites were prepared by heat treatment of the solvent cast PI precursors/PAI blends. The optical micrographs showed that a good compatibility was observed between poly(amic acid) (PAA) and PAI, but in the case of PAME/PAI mixtures, a phase separation apparently occurred due to the absence of ionic and/or H-bonding forces. Regardless of PI precursors, the similar tensile properties were observed. The tensile modulus of the composites were higher than that of the neat polyimide. The X-ray diffraction patterns of the composites showed that the chain rearrangement of PI was increased due to the plasticizing effect of PAI, which has lower glass transition temperature than that of PI, during thermal imidization process.

Keywords:Polyimide Precursor;Polyimide;Polyamideimide;Phase Separation;Tensile Property

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[1] Yamada K, Mitsutake T, Takayanaci M, Kajiyama T, J. Macromol. Sci., A26, 891 (1988)

[2] Kim JB, Yim BT, Park SH, Polym.(Korea), 19(2), 179 (1995)

[3] Hirsch SS, J. Polym. Sci. A: Polym. Chem., 7, 15 (1969)

[4] Edward WN, U.S. Patent, 3,179,514 (1963)

[5] Endyey AI, U.S. Patent, 3,179,663 (1965)

[6] Endyey AI, U.S. Patent, 3,179,633 (1965)

[7] Houliham FM, Bachman BJ, Wilkins CW, Prycle CA, Macromolecules, 22, 4477 (1989)

[8] Rhee SB, Park JW, Moon BS, Chang JY, Macromolecules, 26, 404 (1993)

[9] Stoffel NC, Cramer EJ, Volksan WV, Russell TP, Polymer, 34, 4524 (1993)

[10] Murayama S, Nishisawa H, Ebisawa K, Tamuma T, Tanaka S, Japan Patent, 75,139,829 (1976)

[11] Witt H, Dieterich D, Ger. Patent 1,282,962 (1966)

[12] Kleiner L, Karasz FE, MacKnight WJ, Polym. Eng. Sci., 19, 519 (1979)

[13] Bartlett DW, Barlow JW, Paul DR, J. Appl. Polym. Sci., 27, 2351 (1982)

[14] Krevelen V, "Properties of Polymers", p. 190, Elsevier Science Publishers, New York (1990)