Dielectrometer를 이용한 Glass/Epoxy프리프레그의 경화거동 및 경화물의 열적 특성연구

제갈영순; 이원철; 전영재; 윤남균; Yeong-Soon Gal; Won-Chul Lee; Young-Jae Jeon; Nam-Gyun Yoon

Polymer(Korea), Vol.24, No.3, 350-357, May, 2000

A Study on the Curing Behaviors of Glass/Epoxy Prepreg by Dielectrometer and the Thermal Properties of Cured Glass/Epoxy Composites

제갈영순^†, 이원철¹, 전영재², 윤남균³

경일대학교 교양학부
¹섬유패션학과 경일대학교
²건국대학교 화학과
³국방과학연구소

Yeong-Soon Gal^†, Won-Chul Lee¹, Young-Jae Jeon², and Nam-Gyun Yoon³

Polymer Chemistry Laboratory, Kyungil University, Hayang, Kyungsangbuk-Do 712-701, Korea
¹Department of Textiles and Fashion, Kyungil University, Hayang, Kyungsangbuk-Do 712-701, Korea
²Department of Chemistry, Konkuk University, Seoul 143-701, Korea
³Agency for Defense Development, Yuseong, Taejon 305-600, Korea

E-mail:

초록

인쇄회로기판제조에 사용되는 glass/epoxy 프리프레고의 경화거동을 dielectrometer와 시차주사열분석기를 사용하여 연구하였다. 브롬화한 에폭시수지를 많이 포함하고 있는 본 프리프레고는 약 115℃에서 가장 낮은 이온점도를 보였으며, 이 이후 경화반응의 진행과 함께 점도가 150℃까지는 상승하는 경향을 보여 주었다. 이것은 이 프리프레고의 경화반응이 115℃ 부근에서 개시됨을 의미하며, 이 온도 이후부터 가속화된 분자간 가교화반응을 통해서 분자량이 현저히 커짐을 의미한다. 본 프리프레그의 dynamic scan에 따른 loss factor 및 tan δ값을 측정하였다. 또한 실제 인쇄회로기판 제조에 사용하는 경화주기에 준하여 동일한 실험을 수행하여 그 거동을 비교하였다. 성형한 복합재료는 약 300℃까지는 열적으로 안정한 것으로 나타났으며 이 온도 이후에서 급격한 열분해 반응이 진행되었다.

Curing behaviors of glass/epoxy prepreg for printed circuit boards(PCB) were studied by using dielectrometer and differential scanning calorimeter. This prepreg was showed the lowest ionic viscosity at about 115 ℃, and then the ionic viscosity was gradually increased up to 150 ℃. This indicated that the curing reaction of this prepreg started at 115 ℃ and the molecular weight was increased by the accelerated thermal cross-linking reaction. The loss factor and tan δ values were also measured and discussed. The dielectric behaviors of this prepreg system were also measured according to the cure cycle for PCB. This material was found to be thermally stable up to about 300 ℃ and then was showed an abrupt decomposition beyond this temperature.

Keywords:Curing;Prepreg;Dielectrometer;Ionic viscosity;Thermal properties

[References]

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Rosato DV, Dimattia DP, Rosato DV, "Designing with Plastics and Composites, A Handbook," Van Nostrand Reinhold, New York, 1991 (1991)
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Day DR, "Dielectric Properties of Polymeric Materials," Micromet Instruments, 1988 (1988)
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Day DR, Lewis TJ, Lee HL, Senturia SD, J. Adhes., 18, 73 (1985)
Senturia SD, Sheppard NF, Lee HL, Day DR, J. Adhes., 15, 69 (1982)
Senturia SD, Sheppard NF, Adv. Polym. Sci., 1 (1986)
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[Referenced By]

[1] Margolis JM, "Advanced Thermoset Composites," Van Nostrand Reinhold, New York, 1986 (1986)

[2] Rosato DV, Dimattia DP, Rosato DV, "Designing with Plastics and Composites, A Handbook," Van Nostrand Reinhold, New York, 1991 (1991)

[3] Hollaway L, "Polymer Composites for Civil and Structural Engineering," Blackie Academic & Professional, Cambridge, 1993 (1993)

[4] Lubin G, "Handbook of Composites," Van Nostrand Reinhold, New York, 1982 (1982)

[5] Kowalska M, SAMPE Quarterly, 13, January (1982)

[6] Fitzer E, "Carbon Fibres and Their Composites," Springer-Verlag, Berlin, 1985 (1985)

[7] Nam JD, Ahn KJ, Polym. Sci. Technol., 6(5), 459 (1995)

[8] Kaszyk J, "The Epoxy Resin Formulators Training Manual," The Society of the Plastics Industry, Inc., New York, 1984 (1984)

[9] Yun NG, Kim YC, Chung SK, Jung B, Polym.(Korea), 19(4), 438 (1995)

[10] Day DR, Shepard DD, Wall AS, SAMPE Symp., 33, 603 (1988)

[11] Wetton RE, Forster GM, Smith VR, SAMPE Symp., 33, 1285 (1988)

[12] Wai MP, Parker DJ, SAMPE Symp., 33, 725 (1988)

[13] Kranbuehl D, Hoff M, Haverty P, SAMPE Symp., 33, 1276 (1988)

[14] Daniel VV, "Dielectric Relaxation," p. 18, Academic Press, London and New York, 1967 (1967)

[15] Day DR, "Dielectric Properties of Polymeric Materials," Micromet Instruments, 1988 (1988)

[16] Senturia SD, U.S. Patent, 4,423,371 (1983)

[17] Day DR, Lewis TJ, Lee HL, Senturia SD, J. Adhes., 18, 73 (1985)

[18] Senturia SD, Sheppard NF, Lee HL, Day DR, J. Adhes., 15, 69 (1982)

[19] Senturia SD, Sheppard NF, Adv. Polym. Sci., 1 (1986)

[20] Senturia SD, Sheppard NF, Lee HL, Marshall SB, SAMPE J., 19, 22 (1983)