Influence of temperature on the fracture of a SiOx film (PVD) on a PET substrate was investigated. Parallel multiple cracks were observed in situ during tensile tests at different temperatures ranging from 26 to 150 degrees C, Fewer cracks were observed at elevated temperatures. On the other hand, the crack onset strain was not affected by the temperature. The residual strain in the SiOx film remained constant in this temperature range. These observations were successfully predicted by the shear lag model with an assumption of a unique stress criterion.