화학공학소재연구정보센터
Thin Solid Films, Vol.338, No.1-2, 70-74, 1999
W/Si multilayers deposited by hot-filament MOCVD
W/Si multilayers with eight double layers (double layer spacing d = 20 nm) were deposited on Si [100] substrates using hot-filament (or hot-wire) metal organic chemical vapor deposition (MOCVD). The process was performed in a stainless steel reactor with a tungsten filament at a temperature of 1000 degrees C and a substrate temperature of 190 degrees C. The him thickness and growth was controlled by an in situ soft X-ray reflectivity measurement. The multilayers were characterized by cross-section transmission electron microscopy (XTEM) and sputter auger electron spectroscopy (AES). The results are compared to W/Si bilayers, which were deposited without a hot-filament at higher substrate temperatures (500-670 degrees C).