화학공학소재연구정보센터
Thin Solid Films, Vol.307, No.1-2, 178-182, 1997
X-ray stress measurement for TiN films evaporated by PVD
Residual stress of titanium nitride (TW) films, which were coated by physical vapor deposition (PVD), was measured by an advanced X-ray stress measurement. The commonly used sin(2) Psi method in residual stress measurement is hardly applicable for TiN films with [111] fiber texture because the method requires the isotropy of specimen. In order to take into account the preferred orientations, the analysis in which the weighted average around the normal direction in X-ray diffraction planes was adopted for crystal distributions was proposed in Reuss model. Moreover, the peaks with high intensity for the crystal distribution were determined by the orientation distribution function (O.D.F.). These stresses in the films with [111] preferred orientation could be determined by the X-ray stress measurement.