The texture components of Ag films in evaporated Ag/Ti bilayers have been quantitatively characterized by X-ray pole figure analysis. The effect of an encapsulation process at elevated temperatures on the texture evolution has been explored as well. Both [111] and [511] fiber texture components were observed in the AgO films. The maximum [111] intensity is along the fiber axis that is parallel to the film normal and the maximum [511] intensity deviates slightly from the fiber axis by 1-2 degrees. The latter component is attributed to the twinning of [111] oriented grains. The volume fraction and maximum intensity of the [111] texture are further enhanced by the encapsulation process as opposed to the reduced volume fractions of [511] and randomly oriented grains. Compared to the Al and Cu films processed under comparable conditions, the Ag films possess a stronger [111] texture intensity, a sharper distribution of [111] texture about the fiber axis, and a lower volume fraction of randomly oriented grains. Therefore, an improved electromigration resistance is expected in Ag films. Low resistivity values (1.7-2.2 mu Omega cm) were obtained in the encapsulated Ag films as well as the as-deposited Ag films.