Si nodules that appear in the metal electrodes of integrated circuits often reduce their reliability. The growth process of Si nodules generated on boro-phospho silicate glass (BPSG) in the Al-1 wt.% Si film electrode has been investigated. The Al-1 wt.% Si films sputter deposited on BPSG films were annealed at 723 K for 30 min according to the usual integrated circuit procedure. Scanning electron microscopy and atomic force microscopy observations revealed that the Si nodules seemed to precipitate along Al grain boundaries particularly on the BPSG film and their shape appeared pyramidal. To make clear the mechanism of the growth of the Si nodule on the BPSG film, the interface between the Si nodule and the BPSG film was investigated in detail by transmission electron microscopy, electron diffraction and energy dispersive X-ray spectroscopy. As the result, it was found that there existed an amorphous silicon oxide region in the central part of the interface under the Si nodule, The amorphous silicon oxide is considered to be formed by diffusion of oxygen from the BPSG film to the Si nodule during the annealing. The amorphous silicon oxide may act as an embryo for the formation of the Si nodule and the migration of Si atoms dissolved in Al towards the embryo seems to enhance the growth of the Si nodule.