The electroless and cathodic electrodeposition of metals (Au, Cu, Ni) into porous silicon (PS) is studied. The electrochemically modified PS layers are analysed by X-ray photoelectron spectroscopy and sputter depth profiling. The electroless deposition oxidizes PS simultaneously. For this reaction a new concept of injection current multiplication is proposed. After cathodic metal deposition the pores are filled with metal quantitatively without oxidation of PS.