화학공학소재연구정보센터
Thin Solid Films, Vol.253, No.1-2, 473-478, 1994
Chemical-Vapor-Deposition of TiSi2 Using SiH4 and TiCl4
An experimental approach for optimizing process parameters for TiSi2 chemical vapor deposition is described that combines measurements under ultrahigh vacuum conditions and at normal processing pressures. This approach has given an unprecedentedly detailed view of the chemical mechanisms underlying this deposition system.