Thermal degradation kinetics of epoxy-anhydride resins has been studied by thermogravimetry in both, isothermal and nonisothermal conditions. It was found that the kinetics of thermal degradation can be fairly described by a simple reaction-order model. The calculated kinetic parameters, E-a, and n, are considerably lower for pure resin than for resin containing silica filler. Therefore, the addition of silica filler increases thermal degradation rate of the resin. A difference was also observed between the set of kinetic parameters obtained by kinetic analysis of isothermal and non-isothermal data, particularly with respect to the activation energy.