Dynamic mechanical analysis (DMA) and dielectric analysis (DEA) measurements were made simultaneously in a Perkin-Elmer DMA 7e connected to a Micromet Instruments Eumetric System III Microdielectrometer. Simultaneous DMA-DEA experiments were performed during the nonisothermal cure of an epoxy-glass prepreg. The results showed the techniques to be complementary. DMA provided gel point and vitrification information while DEA provided relative viscosity change, rate of reaction, and was highly sensitive to the end of reaction. The gel and vitrification points identified by DMA were correlated to the DEA data.