The aim of this work is to model the structural relaxation of a fully cured epoxy resin. The samples were subjected to thermal treatments involving isothermal annealing at temperatures T-a for times t(a) before the measuring scan carried out on heating in the DSC. The values of T-a ranged between T-g-8 and T-g-50 degrees C and those of t(a) between 0 and 16000 min. A new model based on the evolution of the configurational entropy was used to simulate the experimental data, obtained previously by one of the authors. A curve of calorimetric relaxation times as a function of reciprocal temperature and the beta parameter of the KWW equation were determined from a comparison between experimental and calculated thermograms. Using the peak shift method, the Narayanaswamy parameter x was determined from both the experimental and simulated scans. The calorimetric relaxation times are compared with those found for dielectric and dynamic-mechanical relaxation.